Global CPU Back Plate Market Growth 2024-2030
Product Code:1228348
Published Date: Sep 27,2024
Pages: 103
Region: Global
Category: Electronics & Semiconductor
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A CPU back plate is a component of computer hardware, usually located on the back of the CPU socket. Its main function is to provide additional support and protection to ensure the stability and safety of the CPU during installation and use. The design of the back plate may include heat sinks, thermal conductive media, etc. to improve the heat dissipation efficiency of the CPU.
The global CPU Back Plate market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
LP Information, Inc. (LPI) ' newest research report, the “CPU Back Plate Industry Forecast” looks at past sales and reviews total world CPU Back Plate sales in 2023, providing a comprehensive analysis by region and market sector of projected CPU Back Plate sales for 2024 through 2030. With CPU Back Plate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world CPU Back Plate industry.
This Insight Report provides a comprehensive analysis of the global CPU Back Plate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on CPU Back Plate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global CPU Back Plate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for CPU Back Plate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global CPU Back Plate.
United States market for CPU Back Plate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for CPU Back Plate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for CPU Back Plate is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key CPU Back Plate players cover Thermalright, NZXT, Intel, Cooler Master, AMD, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of CPU Back Plate market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Plastic Back Plate
Metal Back Plate
Segmentation by Application:
Personal Computers
Servers
Industrial Computers
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Thermalright
NZXT
Intel
Cooler Master
AMD
Dell
Key Questions Addressed in this Report
What is the 10-year outlook for the global CPU Back Plate market?
What factors are driving CPU Back Plate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do CPU Back Plate market opportunities vary by end market size?
How does CPU Back Plate break out by Type, by Application?