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Global Substrate-like PCB (SLP) Market Growth 2024-2030

Global Substrate-like PCB (SLP) Market Growth 2024-2030

Product Code:1239993

Published Date: Nov 19,2024

Pages: 108

Region: Global

Category: Electronics & Semiconductor

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The global Substrate-like PCB (SLP) market size is projected to grow from US$ 2792 million in 2024 to US$ 3542 million in 2030; it is expected to grow at a CAGR of 4.0% from 2024 to 2030.

Substrate-like PCB is abbreviated as SLP, which belongs to the category of PCB. Compared with HDI, the line width/line spacing of SLP can be shortened to 20/35 microns at the minimum. However, in terms of process, it cannot reach the specifications of IC substrate, and it is between HDI and IC substrate.

From the perspective of downstream applications, the current mainstream of SLP-like substrates is used in consumer electronics, such as smart phones. In terms of substrate-like manufacturing, since the mainstream line width/line spacing is 20-30 microns (Zhen Ding Technology's 25-micron SLP has been mass-produced), SLP is mainly manufactured using MSAP process technology. Compared with HDI, under the same conditions, the number of electronic components carried can reach twice that of HDI.

In terms of market competition, the leading companies of SLP-like substrates are mainly Zhen Ding Technology, Kinsus, Meiko, TTM Technologies, etc. The share of the world's top 5 companies exceeds 65%, and the core companies are mainly distributed in Taiwan, Japan, South Korea and the United States. With its high-density wiring, multi-layer stacking structure and excellent advanced packaging compatibility, SLP technology has successfully met the needs of increasingly miniaturized and high-performance electronic products. With the continuous advancement of technology, SLP technology is moving towards higher density and finer lines. However, compared with IC substrates, there is still a certain gap in the fineness of substrate-like substrates, which to a certain extent limits its price competitiveness in high-end applications such as mobile phones, thereby affecting the improvement of profit levels.

LP Information, Inc. (LPI) ' newest research report, the “Substrate-like PCB (SLP) Industry Forecast” looks at past sales and reviews total world Substrate-like PCB (SLP) sales in 2023, providing a comprehensive analysis by region and market sector of projected Substrate-like PCB (SLP) sales for 2024 through 2030. With Substrate-like PCB (SLP) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Substrate-like PCB (SLP) industry.

This Insight Report provides a comprehensive analysis of the global Substrate-like PCB (SLP) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Substrate-like PCB (SLP) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Substrate-like PCB (SLP) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Substrate-like PCB (SLP) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Substrate-like PCB (SLP).

This report presents a comprehensive overview, market shares, and growth opportunities of Substrate-like PCB (SLP) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
    L/S 30μm
    L/S 25μm
    Others

Segmentation by Application:
    Smart Phone
    Other Consumer Electronics
    Automotive Electronics
    Others

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
    Zhen Ding Technology
    KINSUS
    COMPEQ
    Daeduck GDS
    TTM Technologies
    AT＆S
    Ibiden
    Korea Circuit
    Samsung Electro-Mechanics
    Meiko
    Shenzhen Fastprint Circuit Tech
    Unimicron
    Shenzhen Kinwong Electronic
    Leader-Tech Electronics
    AKM Meadville

Key Questions Addressed in this Report
What is the 10-year outlook for the global Substrate-like PCB (SLP) market?
What factors are driving Substrate-like PCB (SLP) market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Substrate-like PCB (SLP) market opportunities vary by end market size?
How does Substrate-like PCB (SLP) break out by Type, by Application?