Global Underfill Market Growth 2023-2029

Global Underfill Market Growth 2023-2029

Product Code:449096

Published Date: Feb 08,2023

Pages: 113

Region: Global

Category: Electronics & Semiconductor

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This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

LPI (LP Information)' newest research report, the “Underfill Industry Forecast” looks at past sales and reviews total world Underfill sales in 2022, providing a comprehensive analysis by region and market sector of projected Underfill sales for 2023 through 2029. With Underfill sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill industry.

This Insight Report provides a comprehensive analysis of the global Underfill landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Underfill market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill.

The global Underfill market size is projected to grow from US$ 432.9 million in 2022 to US$ 559.5 million in 2029; it is expected to grow at a CAGR of 559.5 from 2023 to 2029.

North America is the largest market with about 38% market share. China is follower, accounting for about 20% market share.

The key players are Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond, DOVER, Darbond, HIGHTITE, U-bond etc. Top 3 companies occupied about 45% market share.

This report presents a comprehensive overview, market shares, and growth opportunities of Underfill market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:
Segmentation by type
    Semiconductor Underfills
    Board Level Underfills

Segmentation by application
    Industrial Electronics
    Defense & Aerospace Electronics
    Consumer Electronics
    Automotive Electronics
    Medical Electronics
    Others

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
    Henkel
    WON CHEMICAL
    NAMICS
    SUNSTAR
    Hitachi Chemical
    Fuji
    Shin-Etsu Chemical
    Bondline
    AIM Solder
    Zymet
    Panacol-Elosol
    Master Bond
    DOVER
    Darbond
    HIGHTITE
    U-bond

Key Questions Addressed in this Report
What is the 10-year outlook for the global Underfill market?
What factors are driving Underfill market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Underfill market opportunities vary by end market size?
How does Underfill break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?