Global IC Packaging Market Growth 2023-2029

Global IC Packaging Market Growth 2023-2029

Product Code:454263

Published Date: Feb 08,2023

Pages: 126

Region: Global

Category: Electronics & Semiconductor

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IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.

LPI (LP Information)' newest research report, the “IC Packaging Industry Forecast” looks at past sales and reviews total world IC Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected IC Packaging sales for 2023 through 2029. With IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Packaging industry.

This Insight Report provides a comprehensive analysis of the global IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global IC Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Packaging.

The global IC Packaging market size is projected to grow from US$ 37130 million in 2022 to US$ 48680 million in 2029; it is expected to grow at a CAGR of 48680 from 2023 to 2029.

Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.

China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:
Segmentation by type
    DIP
    SOP
    QFP
    QFN
    BGA
    CSP
    LGA
    WLP
    FC
    Others

Segmentation by application
    CIS
    MEMS
    Others

This report also splits the market by region:
    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
    ASE
    Amkor
    SPIL
    STATS ChipPac
    Powertech Technology
    J-devices
    UTAC
    JECT
    ChipMOS
    Chipbond
    KYEC
    STS Semiconductor
    Huatian
    MPl(Carsem)
    Nepes
    FATC
    Walton
    Unisem
    NantongFujitsu Microelectronics
    Hana Micron
    Signetics
    LINGSEN

Key Questions Addressed in this Report
What is the 10-year outlook for the global IC Packaging market?
What factors are driving IC Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Packaging market opportunities vary by end market size?
How does IC Packaging break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?