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Global Laser Grooving Equipment for Semiconductor Market Growth 2024-2030
Product Code:815650
Published Date: Dec 08,2024
Pages: 121
Region: Global
Category: Electronics & Semiconductor
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The global Laser Grooving Equipment for Semiconductor market size is predicted to grow from US$ 544 million in 2024 to US$ 1260 million in 2030; it is expected to grow at a CAGR of 15.0% from 2024 to 2030.
Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.
The Laser Grooving Equipment for Semiconductor market has shown strong growth momentum in recent years, mainly benefiting from the rapid development of the semiconductor industry and the increased demand for precision manufacturing processes. At present, there are several well-known companies in the market that have occupied an important position in terms of technological innovation and market share. In the future, with the further popularization of fields such as 5G, artificial intelligence, and the Internet of Things, the market demand for Laser Grooving Equipment is expected to continue to grow. At the same time, technological progress and innovation will drive the improvement of equipment performance, reduce production costs, and improve production efficiency. In addition, the demand for environmental protection and sustainable development will also prompt companies to develop more energy-saving and environmentally friendly equipment. Overall, the Laser Grooving Equipment market has broad prospects and will usher in more opportunities and challenges in the next few years.
Global top five manufacturers of laser grooving equipment for semiconductor occupied for a share over 80 percent, key players are DISCO, ASM Laser Separation International (ALSI), EO Technics, Wuhan DR Laser Technology and Delphi Laser etc. Geographically speaking, Japan holds the most of global market share, about 30%. China holds about 25% of share, while North America followed by nearly 20%. In terms of product, the type of 12 Inch is the largest segment, with a share over 45%. And in terms of application, the largest application is semiconductor wafer, which takes nearly 70%.
LP Information, Inc. (LPI) ' newest research report, the “Laser Grooving Equipment for Semiconductor Industry Forecast” looks at past sales and reviews total world Laser Grooving Equipment for Semiconductor sales in 2023, providing a comprehensive analysis by region and market sector of projected Laser Grooving Equipment for Semiconductor sales for 2024 through 2030. With Laser Grooving Equipment for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Laser Grooving Equipment for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Laser Grooving Equipment for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Laser Grooving Equipment for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Laser Grooving Equipment for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Laser Grooving Equipment for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Laser Grooving Equipment for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Laser Grooving Equipment for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
8 Inch
12 Inch
Others
Segmentation by Application:
Semiconductor Wafer
Solar Cells
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuxi Lead Intelligent Equipment
Wuhan Huagong Laser Engineering
Key Questions Addressed in this Report
What is the 10-year outlook for the global Laser Grooving Equipment for Semiconductor market?
What factors are driving Laser Grooving Equipment for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Laser Grooving Equipment for Semiconductor market opportunities vary by end market size?
How does Laser Grooving Equipment for Semiconductor break out by Type, by Application?